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WAFER BISCUIT PRODUCTION PROCESS
MIXING
Batter preparation
First step in wafer mixing is to prepare batter . wheat/ flour
( low gluten type )is mixed with water and other ingredient s
in batter mixer to get a thinbatter of suitable consistency .
Mixing time could be 2- 5 Minute batter is thentransferred to
batter storage tank from where it can be transferred to baking
plate.
Cream Preparation
Creams are prepared in mixers where ingredients like flavours , colors , whey powder and soya
lecithin are added . Cream of suitable consistency are prepared . Various types creams are popular
in wafer biscuit are chocolate s , milk , caramel , orange , banana , strawberry , hazelnut and others
.
Cream preparation could take place between 10- 12 mins. Cream then can be transferred to
reservoir.
BAKING
Batter is then pumped and spread on to baking plate by help spreading nozzles . These plates then
moves into baking zone of the oven . Temperature maintained for baaing these wafer baking plates
is between 175 - 200 deg c . The baking time kept is 1.75 - 2.0 min . Capacity of oven can be from
50 - 100 plates . Size of plate can also varies from 400 x300 to 300 x 200 mm and thickness is
maintained between 2.5 - 3mm. Most of these wafer ovens are electrical oven s. These plates travel
upon guide rail and electrical power is supplied through bus bars inside the oven . Baking plates
are in contact with bus bar through carbon brushes.
Wafer Oven
CREAMING
These wafer sheets are the allowed to cool down by moving through one or two arch's .Cooled
wafer sheets are then taken to spreading machine . Cream is then spread over wafer sheets at
creaming machines Once the block of 2/3/4/5 layers of creamed wafer is made , the block is then
moved to cooling block
COOLING TOWER
Wafer sandwich blocks are then cooled to harden and creams get set on wafer block . The cooling
block is dehumidified to reduce the moisture absorption by wafers during cooling . Temperature
maintained in cooling block is between 10- 15 deg c.
CUTTING AND FEEDING
Fully automated cutting is done at cutting machines .Here we can cut wafer blocks in different sizes.
These fingers are then passed on to feed conveyor for packing
PACKING
Horizontal flow wrap are used to pack these fingers .These fingers are packed in heat sealable
moisture proof films for good shelf life . These packets are then packed into cbbs for dispatch .
Specifications of wafer products are
size of wafer sheet = length x breadth
thickness of wafer sheet= 3mm normally
size of fingers= lxb
layers of creams
layers of wafer sheet
ht of fingers with cream
pack arrangement = 1pile ,2pile , 3pile
wt of sheet
wt of finger
Next-------- Ingredients and Equipments for wafer biscuit manufacturing
MIXING
Batter preparation
First step in wafer mixing is to prepare batter . wheat/ flour
( low gluten type )is mixed with water and other ingredient s
in batter mixer to get a thinbatter of suitable consistency .
Mixing time could be 2- 5 Minute batter is thentransferred to
batter storage tank from where it can be transferred to baking
plate.
Cream Preparation
Creams are prepared in mixers where ingredients like flavours , colors , whey powder and soya
lecithin are added . Cream of suitable consistency are prepared . Various types creams are popular
in wafer biscuit are chocolate s , milk , caramel , orange , banana , strawberry , hazelnut and others
.
Cream preparation could take place between 10- 12 mins. Cream then can be transferred to
reservoir.
BAKING
Batter is then pumped and spread on to baking plate by help spreading nozzles . These plates then
moves into baking zone of the oven . Temperature maintained for baaing these wafer baking plates
is between 175 - 200 deg c . The baking time kept is 1.75 - 2.0 min . Capacity of oven can be from
50 - 100 plates . Size of plate can also varies from 400 x300 to 300 x 200 mm and thickness is
maintained between 2.5 - 3mm. Most of these wafer ovens are electrical oven s. These plates travel
upon guide rail and electrical power is supplied through bus bars inside the oven . Baking plates
are in contact with bus bar through carbon brushes.
Wafer Oven
CREAMING
These wafer sheets are the allowed to cool down by moving through one or two arch's .Cooled
wafer sheets are then taken to spreading machine . Cream is then spread over wafer sheets at
creaming machines Once the block of 2/3/4/5 layers of creamed wafer is made , the block is then
moved to cooling block
COOLING TOWER
Wafer sandwich blocks are then cooled to harden and creams get set on wafer block . The cooling
block is dehumidified to reduce the moisture absorption by wafers during cooling . Temperature
maintained in cooling block is between 10- 15 deg c.
CUTTING AND FEEDING
Fully automated cutting is done at cutting machines .Here we can cut wafer blocks in different sizes.
These fingers are then passed on to feed conveyor for packing
PACKING
Horizontal flow wrap are used to pack these fingers .These fingers are packed in heat sealable
moisture proof films for good shelf life . These packets are then packed into cbbs for dispatch .
Specifications of wafer products are
size of wafer sheet = length x breadth
thickness of wafer sheet= 3mm normally
size of fingers= lxb
layers of creams
layers of wafer sheet
ht of fingers with cream
pack arrangement = 1pile ,2pile , 3pile
wt of sheet
wt of finger
Next-------- Ingredients and Equipments for wafer biscuit manufacturing
